Wednesday, 21 September, 2011
14:30 -- 16:00
Le Saleve

We.9.LeSaleve • Optical Interconnect

Chair: Bert Offrein; IBM, Switzerland
 
We.9.LeSaleve.1 • 14:30 (Invited)
Optical Interconnects in Exascale Supercomputers
Jeff Kash1; 1IBM, USA. Abstract not available.
 
We.9.LeSaleve.2 • 15:00
6 Gbit/s Full-Duplex Multimode Fiber Link with Monolithic VCSEL-PIN Transceiver Chips
Alexander Kern1, Sujoy Paul1, Dietmar Wahl1, Alexander Hein1, Rudolf Rösch1, Wolfgang Schwarz1, Rainer Michalzik1; 1Institute of Optoelectronics, Ulm University, Germany.
We present design, fabrication and operation of AlGaAs-based monolithically integrated VCSEL-PIN photodetector transceiver chips. 6 Gbit/s full-duplex and 7 Gbit/s half-duplex error-free data transmission over a 500 m long standard multimode fiber are demonstrated.
 
We.9.LeSaleve.3 • 15:15
10Gbps bias-free all-optical wavelength conversion using InP-microdisk resonators heterogeneously integrated onto SOI
Geert Morthier1, Rajesh Kumar1, Thijs Spuesens1, Dries Van Thourhout1, Gunther Roelkens1, Pauline Mechet1, Philippe Regreny3, Jean-Marc Fedeli2, Nicolas Olivier2; 1Information Technology, Ghent University - imec, Belgium; 2Institut des nanotechnologies de Lyon, Ecole centrale de Lyon, France; 3Minatec campus, CEA-LETI, France.
Using InP-based microdisks heterogeneously integrated onto silicon waveguide circuits, we demonstrate all-optical wavelength conversion of 10Gbps NRZ signals without any bias or seeding beam. The experimental results indicate that bitrates of 20Gbps should be achievable.
 
We.9.LeSaleve.4 • 15:30 (Invited)
First Demonstration of High Density Optical Interconnects Integrated with Lasers, Optical Modulators and Photodetectors on a Single Silicon Substrate
Yutaka Urino1, Takanori Shimizu1, Makoto Okano2, Nobuaki Hatori1, Masashige Ishizaka1, Tsuyoshi Yamamoto1, Takeshi Baba1, Takeshi Akagawa1, Suguru Akiyama1, Tatsuya Usuki1, Daisuke Okamoto1, Makoto Miura1, Masataka Noguchi1, Junichi Fujikata1, Daisuke Shimura3, Hideaki Okayama3, Tai Tsuchizawa4, Toshifumi Watanabe4, Koji Yamada4, Seiichi Itabashi4, Emiko Saito1, Takahiro Nakamura1, Yasuhiko Arakawa5; 1Photonics Electronics Technology Research Association (PETRA), Japan; 2National Institute of Advanced Industrial Science and Technology (AIST), Japan; 3Photonics Electronics Technology Research Association (PETRA), Japan; 4NTT Microsystem Integration Laboratories, Japan; 5Institute of Industrial Science, The University of Tokyo, Japan.
Optical interconnects integrated with lasers, silicon optical modulators and germanium photodetectors on a single silicon substrate were demonstrated for the first time. A 5 Gbps line bit rate and 3.5 Tbps/cm2 transmission density were achieved.


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